SK Hynix to Break Ground on Indiana Packaging Plant Aug. 27; Chey-Huang Meeting in Focus
Summary
- SK Hynix said it will hold a groundbreaking ceremony on Aug. 27 for its advanced semiconductor packaging plant in West Lafayette, Indiana.
- A meeting between Chairman Chey Tae-won and Nvidia CEO Jensen Huang at the ceremony could produce additional plans for semiconductor facility investment in the US.
- SK Hynix plans to invest $3.87 billion and begin mass production of next-generation AI memory products including HBM in the second half of 2028, with support from the US government through CHIPS Act subsidies and loans.
Forecast Trend Report by Period
SK Hynix will hold a groundbreaking ceremony on Aug. 27 for its advanced semiconductor packaging plant in Indiana. Chief Executive Officer Kwak Noh-jung and other senior executives are set to attend, while the event is also drawing attention for the possibility of another meeting between SK Group Chairman Chey Tae-won and Nvidia Chief Executive Officer Jensen Huang.
SK Hynix has finalized Aug. 27 for the ceremony at the advanced semiconductor packaging fab it is developing in West Lafayette, Indiana, according to industry officials on Aug. 12. The company has sent formal invitations to major customers and partner companies.
Kwak and other top executives are scheduled to attend. Industry officials are also watching for a possible meeting between Chey and Huang.
If the two executives meet, the event could offer a further outline of additional semiconductor investment plans in the US. Their companies have maintained close cooperation in AI data center operations and in supplies of high-bandwidth memory, or HBM, and graphics processing units.
Chey previously raised the possibility of memory production expansion in the US. In an interview with local media after the listing of the company’s American depositary receipts, he said a memory plant could be built if conditions such as power, water, labor and supply chains are in place.
The prospect of further investment has also coincided with pressure from Washington. US Commerce Secretary Howard Lutnick recently publicly urged South Korean chipmakers to expand production in the US.
SK Hynix is building the advanced packaging plant in West Lafayette with a $3.87 billion investment. The company aims to begin mass production of next-generation AI memory products, including HBM, in the second half of 2028.
The US government previously agreed to support the project under the CHIPS Act with direct subsidies of as much as $450 million and loans of $500 million.
Noh Jung-dong, Hankyung.com reporter dong2@hankyung.com
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